Lectronix’s expertise is in the assembly of high mix, high density printed circuit board assemblies. We support both high and low-mix assembly volumes that range from just a few prototype units to modest quantities for pre-production, to thousands in volume production.
Printed Circuit Board Assembly (PCBA) Capabilities
Driven by the skills of our in-house engineering experts, we provide:
- Optimized test development and support that considers all aspects of test, including failure analysis
- Competitive test cost, quality and availability
- Services including Optical and X-ray inspection (AOI and AXI), and functional test (FT) development
Electronic Manufacturing Capabilities
As a leading provider of Printed Circuit Board Assembly (PCBA), Lectronix offers customers a full range of assembly services including:
- High density products
- Low-volume prototyping
- Low-volume / high-mix
- High-volume / low-mix
- Build to order
- Configure to order
Component Placement Capabilities
We combine advanced processes with highly skilled resources. Our innovative techniques extend to sophisticated packaging and assembly technology to including:
- Placement of Discrete components down to 0402
- Placement of 12mil high pin count leaded packages down to .5mm micro-BGA
- Placement of QFN package devices
- Uses a no clean solder process
- ROHS – Leaded and Lead-free compatible
- Application of Conformal Coatings